| Time |
Topic |
Speaker |
| Session 1: Processes for Pb Free Assembly |
09:00am–
09:30am |
"The Property and Thickness Evaluation of High Temperature Resistant OSP Coatings for Lead-Free Assembly Processes" |
Dr. Jiang Jian Ping, Cookson
Electronics |
09:30am–
10:00am |
"How to Choose No Clean Alcohol Based Chemical Flux in the Lead-Free Wave Soldering Process" |
Xiaobai Wang, Kester Components |
10:00am–
10:30am |
"Testing of Lead Free Solder Joints with 2D and 3D X-Ray |
Friedhelm Maur, COMET Shanghai |
10:30am–
10:45am |
Tea Break |
| Session 2: RoHS Infrasturcture |
10:45am–
11:15am |
"Sustained Corporate Environmental Progress" |
Joyce Tse and Evelyn Baldwin, 3M Electronics, 3M China Ltd |
11:15am–
11:45am |
"Transitioning to RoHS Compliance-A Two Tier EMS Case Study" |
LinangJun Zeng, CTS Corporation |
11:45am–
12:15am |
"Zero Defect Approach in Lead-Free Soldering Process" |
Seet Keng Seng, KIC |
12:15pm–
14:00pm |
Lunch |
| Session 3：Pb Free Reliability |
14:00pm–
14:30pm |
"Fragility of Sn/Pb and Lead-Free Solder Joints" |
Zheng Chen, Universal Instruments Corporation |
14:30pm–
15:00pm |
Using Underfills to Enhance Drop Test Reliability of Pb-free Solder Joints in Advanced Chip Scale Packages" |
Cyril Zhang, Henkel Technologies |
15:00pm–
15:30pm |
"BGA Assemblies Reliability Improvement During the Implementation of Pb-Free Soldering for Mass Production" |
Wendy Wang, Motorola Labs |
15:30pm–
15:45pm |
Tea Break |
15:45pm–
16:15pm |
"A Study of Discoloration Issue on Ni/Au Plated Connector" |
Zhang Ruifen, Kester Components |
16:15pm–
16:45pm |
"A Study of Planar Micro-Voiding in Pb-Fee Solder Joints" |
Marco Mui, Cookson Electronics |
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