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SMTA China North Conference 2008 | |||||||||||||||||||||
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The SMTA China will organize the SMTA China North Conference 2008 in Tianjin on 10-12 November, 2008. This timely event will be held in conjunction with Bohai Electronics Week 2008 and will address the industry’s most pressing issues concerning electronics manufacturing, advanced packaging and lead-free reliability.
Technology Conference/Vendor Conference Topics (10 November 2008)
- 01005 Assembly
- 3D SiP (System in Package)
- Challenges of PCB Fabrication Technology and Surface Finish Component Supply Integrity
- Cost Reduction Initiative
- Advanced Low I/O Packaging
- Flex Circuit Assembly
- Market Trends in Assembly Manufacture
- Manufacturing Engineering
- Materials and Process Characterization
- Pb Free Processes and Product Reliability PoP (Package on Package)
- Process Control Excellence
- Production and Supply Chain Management RoHS Compliance and Materials
- Risk Free Rework/Repairing
- State of Art Inspection and Failure Analysis
Enquiry and Registration: E-mail to peggy@smta.org