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SMTA China North Technical Conference |
10th November 2008 (Monday)
| (CN08-TC) |
Technology Conference | |
|
Conference Chairman | ||
| Venue | Xinhua Room,2/F., Tianjin International Exhibition Center, Tianjin, China | |
| Time | Topic | Speaker |
| Session 1 | ||
| 09:30–10:00 | The Art of Repeating Profiling in Reflow Soldering Process (CN08-TC1) | Vincent Goh KIC Inc |
| 10:00–10:30 |
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization (CN08-TC2) |
Dr. Ningcheng Lee Indium Corporation of American |
| 10:30–11:00 | Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print (CN08-TC3) | Dr. Ningcheng Lee Indium Corporation of American |
| 11:00–11:15 |
Coffee Break | |
| Session 2 | ||
| 11:15–11:45 | Carbon Footprint Research on Mobile products (CN08-TC4) | Dr. Jessie Wang Motorola (China) Electrical LTD |
| 11:45–12:15 | Flip Chip Assembly (CN08-TC5) | Huilai Feng / Justin Ye Universal Instruments |
| 12:15–13:45 |
Lunch Break | |
| Session 3 | ||
| 13:45–14:15 | Package-on-Package Assembly (CN08-TC6) | Huilai Feng / Justin Ye Universal Instruments |
| 14:15–14:45 | Cleanliness Requirements Prior to Conformal Coating (CN08-TC7) | Huang Xiaoying TIETOP Technology Co., Ltd |
| 14:45–15:00 |
Coffee Break | |
| Session 4 | ||
| 15:00–15:30 | PWB Creeping Corrosion Mechanism and Mitigation Strategy (CN08-TC8) | Sunny Mu / Marco Mui Cookson Electronics-Enthone |
| 15:30–16:00 | How to bring X-ray Microfocus Computed Tomography (µCT) from Lab to the Production Floor? (CN08-TC9) |
Friedhelm Maur YXLON Feinfocus, Shanghai |
| 16:00–16:30 | The SnAgCu Solder Joint Failure of BGA Type Package in Board Level Application (CN08-TC10) | Jeffrey Lee IST-Integrated Service Technology Inc |
All papers will be presented in Chinese
11th November 2008 (Tuesday)
| (CN08-VC) |
Vendor Conference | |
|
Conference Chairman | ||
| Venue | Xinhua Room,2/F., Tianjin International Exhibition Center, Tianjin, China | |
| Time | Topic | Speaker |
| Session 1 | ||
| 10:30–11:00 |
Peek for Lead-Free Soldering Processes and Electronics Applications (CN08-VC1) |
Eastward Yu Victrex PLC |
| 11:00–11:30 | SIPLACE X Series machines (CN08-VC2) |
Maurice Liao Siemens Electronics Assembly systems Ltd |
All papers will be presented in Chinese
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Pls. click here to download the entry form. (103KB) |
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